# PIC Packaging at PhotonFirst > PIC Packaging for harsh environments ## Pages - [Accessibility statement](https://picpackaging.photonfirst.com/accessibility-statement/): Accessibility Statement for https://picpackaging. photonfirst. com PhotonFirst Technologies is committed to ensuring digital accessibility for people with disabilities. We are... - [Harsh environments](https://picpackaging.photonfirst.com/harsh-environments/): Harsh Environments and Qualification of Photonic Integrated Circuit (PIC) Packages that meet conditions beyond conventional photonics - [PIC Packaging Capabilities](https://picpackaging.photonfirst.com/pic-packaging-capabilities/): PIC packaging capabilities for ruggedized PIC packages - Ranging from prototype to scaled deployment in aerospace, infrastructure, offshore and quantum systems - [About Photonfirst PIC Packaging Services](https://picpackaging.photonfirst.com/about-photonfirst-pic-packaging-services/): Chip-based systems that work in harsh environments. PhotonFirst offers customised PIC packaging services, especially focusing on harsh environment applications. - [Home](https://picpackaging.photonfirst.com/): We design, manufacture and assemble PIC packagings that keep working under random vibrations, temperature swings, mechanical stress and the shock of being lifted to space. - [PIC Packaging use cases](https://picpackaging.photonfirst.com/use-cases/): Harsh Environments use cases PhotonFirst PIC packages appear in a variety of applications. Here are selected use cases that highlight... - [Privacy Policy](https://picpackaging.photonfirst.com/privacy-policy/): Privacy Policy of PhotonFirst Technologies In order to receive information about your Personal Data, the purposes and the parties the... - [Our benefits](https://picpackaging.photonfirst.com/our-benefits/): We offer a wide range of Digital 20+ Years Experience Whether you’re a seasoned professional or just starting your career... - [FAQ](https://picpackaging.photonfirst.com/faq/): FAQ What Makes Us Stand Out From the Rest How about something like “Empowering Your Workplace: Discover Our HR Management... - [Team](https://picpackaging.photonfirst.com/team/): Co-Ordinator Amelia Robinson Co-Ordinator Natalie Wood Co-Ordinator Nico Robin Co-Ordinator William Young Co-Ordinator David Miller Co-Ordinator Monica Bellucci - [Blog](https://picpackaging.photonfirst.com/blog/) ## Posts # # Detailed Content ## Pages - Published: 2026-09-23 - Modified: 2026-09-23 - URL: https://picpackaging.photonfirst.com/accessibility-statement/ Accessibility Statement for https://picpackaging. photonfirst. com PhotonFirst Technologies is committed to ensuring digital accessibility for people with disabilities. We are continually improving the user experience for everyone and applying the relevant accessibility standards. Conformance status The Web Content Accessibility Guidelines (WCAG) defines requirements for designers and developers to improve accessibility for people with disabilities. It defines three levels of conformance: Level A, Level AA, and Level AAA. PhotonFirst Technologies is making constant efforts to improve the accessibility of its site and services in the belief that it is our collective moral obligation to allow seamless, accessible, and unhindered use for those of us with disabilities. We aim to make all pages and content on https://picpackaging. photonfirst. com accessible, but some content may not yet fully meet the highest accessibility standards. This could be due to challenges in identifying the most suitable technological solution. We may revise this Statement periodically to reflect improvements or changes to our accessibility practices. Feedback We welcome your feedback on the accessibility of PhotonFirst Technologies website. Please let us know if you encounter accessibility barriers on our website: E-mail: info@photonfirst. com We try to respond to feedback within 3–5 business days. This statement was created on 23-9-2026. > Harsh Environments and Qualification of Photonic Integrated Circuit (PIC) Packages that meet conditions beyond conventional photonics - Published: 2026-07-27 - Modified: 2026-10-19 - URL: https://picpackaging.photonfirst.com/harsh-environments/ Harsh Environments and Qualification of Photonic Integrated Circuit (PIC) Packages What are harsh environments? Harsh environments are operating conditions that exceed the limits of standard commercial photonics components and can degrade performance or cause complete device failure. They are commonly encountered in aerospace, defence, industrial, automotive, and space applications, where maintenance is difficult or impossible and reliability is critical. READ MORE ABOUT OUR PIC PACKAGING CAPABILITIES The primary environmental stressors include:Thermal extremes: High and low temperatures, rapid temperature cycling and thermal shock. Mechanical stress: High vibration, shock, and acceleration during launch, flight, transportation, or military deployment. Moisture and chemical exposure: Humidity, salt fog, corrosive gases, and vacuum environments promote corrosion, contamination, or material degradation. Radiation: Ionising radiation and electromagnetic interference can alter semiconductor behaviour or damage the opto-electronics. Because these conditions exceed the capabilities of conventional photonics, specialised packaging materials, epoxies, manufacturing processes, fiber strategies and qualification standards are required. Challenges for PIC Packages Photonic Integrated Circuits (PICs) are particularly sensitive to harsh environments because they combine electronic and optical components, whose performance depends on sub-micron-scale alignment. Small mechanical or material changes that have little effect on conventional optics can significantly increase optical loss or reduce device performance in photonics integrated circuits. One of the main challenges is Coefficient of Thermal Expansion (CTE) mismatch, where materials such as silicon, Indium Phosphide (InP), ceramics, and metal submounts expand at different rates during temperature changes. This can introduce stress, crack solder joints, and misalign optical fibers from the photonic chip. Mechanical shock... > PIC packaging capabilities for ruggedized PIC packages - Ranging from prototype to scaled deployment in aerospace, infrastructure, offshore and quantum systems - Published: 2026-07-23 - Modified: 2026-10-19 - URL: https://picpackaging.photonfirst.com/pic-packaging-capabilities/ The PIC Packaging capabilities we offer From prototype to scaled deployment in aerospace, infrastructure, offshore and quantum systems – We build ruggedized packages for PICs serving the world’s most demanding environments and develop the systems required to operate them. Our products are engineered for deployment, not just for the lab. Qualified. Deployed. Proven. Learn more about harsh environments Harsh‑environment expertise Over 2 decades of experience in packaging and deploying PICs in the harshest environments, such as defence and aerospace. All, while complying with MIL-STD and DO-standards. State-of-the-art FacilitiesCleanroom manufacturing (ISO 14644-1 Class 8 environment with strict ESD controls) and proven performance in mission‑critical applications. Pure Play Packaging ServicesSupporting from the development of early prototypes all the way to validated series products and transferring the technology to our customers. System integration & qualificationDeep domain knowledge of building and qualifying systems for harsh environments, including electronics, software, mechanical design and testing. Our PIC packaging capabilities PIC package designTogether with your team, our experts consider optical, electrical, mechanical, thermal and reliability aspects of your end application during the design of your PIC package. PIC testingWe offer die-level testing of PIC and fiber arrays. Using Known Good Dies (KGD) and well tested parts, significantly increases the yield of your packaged PIC. Die bondingOur automated system places, glues or solders the components, with an accuracy ranging from ± 20 µm to ± 2 µm. This is followed by detailed inspection. WirebondingWe cover frequency ranges from DC up to 40 GHz by using manual and automated... > Chip-based systems that work in harsh environments. PhotonFirst offers customised PIC packaging services, especially focusing on harsh environment applications. - Published: 2026-07-02 - Modified: 2026-10-19 - URL: https://picpackaging.photonfirst.com/about-photonfirst-pic-packaging-services/ Our legacy PhotonFirst brings 20 years of integrated photonics sensing experience to every package we build. Founded in 2006 by Pim Kat, Technobis Fiber Technologies B. V. started developing chip-based fiber optic sensing. This activity was spun out as PhotonFirst in 2021. PhotonFirst specialises in building fiber optic sensing systems and interrogators for harsh environments. One of the fundamental building blocks of such a system is the packaged PIC itself. Today, PhotonFirst offers customised PIC packaging services to external customers, especially focusing on harsh environment applications. https://youtu. be/5S7jGrNvu3M? si=fZK8IynESlmYDuBJ Our ecosystem We are embedded in a larger ecosystem of peers and partners. AddressPyrietstraat 2a, 1812 SC Alkmaar The Netherlands Contact our team+31 850076700, picpackaging@photonfirst. com Office hoursMon-Fri 9. 00 am - 5. 00 pm Send us your question Δ > We design, manufacture and assemble PIC packagings that keep working under random vibrations, temperature swings, mechanical stress and the shock of being lifted to space. - Published: 2026-07-01 - Modified: 2026-10-19 - URL: https://picpackaging.photonfirst.com/ PIC Packaging for Mission-Critical Systems Photonic Integrated Circuits are not just a promise, they are the next step in energy-efficient computing, sensing, quantum technologies, and ultra-fast data communication. From the first prototype and the proof-of-concept to a qualified module that flies on satellites, functions in industrial harsh environments or survives in the rugged environments of defence equipment, we engineer dedicated packaging solutions. We design, manufacture and assemble packages that keep working under random vibrations, temperature swings, mechanical stress and the shock of being lifted to space. GET IN TOUCH CHECK OUR USE CASES Harsh environments expose PIC packages to extreme thermal, mechanical, chemical, and radiation stresses that can degrade both structural integrity and optical performance. Compared with conventional electronics, PICs are especially sensitive because the packages themselves consist of multiple materials with different properties. Their functionality depends on maintaining precise optical alignment. Successful deployment in aerospace and defence therefore requires robust package design, carefully selected materials, hermetic sealing, radiation tolerance, and qualification through established military and space reliability standards. Why partner with PhotonFirst? Facilities and CapabilitiesOur - Published: 2026-03-17 - Modified: 2026-09-07 - URL: https://picpackaging.photonfirst.com/use-cases/ Harsh Environments use cases PhotonFirst PIC packages appear in a variety of applications. Here are selected use cases that highlight our track record. Radiation Hardened Sun Sensing – Lens R&D B. V. Lens R&D and PhotonFirst join forces to bring space grade photonic innovation from concept to scalable production, starting with the MAUS CubeSat sun sensor and its custom PIC package. This... Aerospace – ArianeGroupOur integrated photonics-based fiber optic sensing systems are now being deployed by ArianeGroup on Themis, the reusable first-stage demonstrator for Europe’s next-generation launcher. Aerospace interrogatorsFBG Interrogators designed for Aerospace and Defense Fiber HUMS. PhotonFirst's AGTR-NG4 and AGTR-NEO interrogators represent the forefront of Fiber Bragg Grating (FBG) technology, engineered to deliver unparalleled performance in the... Solinide PhotonicsSolinide needed a partner with the experience and infrastructure to handle precision photonic packaging: fiber coupling, laser alignment, and thermal management. All at micron-level accuracy. - Published: 2026-01-28 - Modified: 2026-10-06 - URL: https://picpackaging.photonfirst.com/privacy-policy/ Privacy Policy of PhotonFirst Technologies In order to receive information about your Personal Data, the purposes and the parties the Data is shared with, contact the Owner. Owner and Data Controller Types of Data collected The owner does not provide a list of Personal Data types collected. Complete details on each type of Personal Data collected are provided in the dedicated sections of this privacy policy or by specific explanation texts displayed prior to the Data collection. Personal Data may be freely provided by the User, or, in case of Usage Data, collected automatically when using this Application. Unless specified otherwise, all Data requested by this Application is mandatory and failure to provide this Data may make it impossible for this Application to provide its services. In cases where this Application specifically states that some Data is not mandatory, Users are free not to communicate this Data without consequences to the availability or the functioning of the Service. Users who are uncertain about which Personal Data is mandatory are welcome to contact the Owner. Any use of Cookies – or of other tracking tools — by this Application or by the owners of third-party services used by this Application serves the purpose of providing the Service required by the User, in addition to any other purposes described in the present document and in the Cookie Policy. Users are responsible for any third-party Personal Data obtained, published or shared through this Application. Mode and place of processing the Data Methods of... - Published: 2025-02-10 - Modified: 2026-04-22 - URL: https://picpackaging.photonfirst.com/our-benefits/ We offer a wide range of Digital 20+ Years ExperienceWhether you're a seasoned professional or just starting your career journey. Clients Around World0+ WHAT WE OFFERThe best parts of working at Photonfirst 01. Your experienceBe part of an entrepreneurial adventure in a deep‑tech scale‑up with highly educated colleagues and unique technology. Above all, enjoy a collaborative, supportive atmosphere with diverse and frequent team activities. 02. Your benefitsBenefits are there to give you peace of mind, freedom to organize your life and the energy to keep pioneering in photonic sensing together with us. 03. Your growthOn top of your package you grow through on‑the‑job learning, working with specialists in photonics, electronics and software and taking responsibility in projects early on. https://8894127. fs1. hubspotusercontent-na1. net/hubfs/8894127/PhotonJobs-CaseFilm-HesselTijseling_V1. 2. mp4 CAREERS AT PHOTONFIRSTEmbracing a pioneering attitude Combined with the evolution of our high end technology, we embrace a collaborative and supportive atmosphere where each team member plays a vital role in our collective success. We are always looking for talented new colleagues with an innovative attitude who can add to our company culture. If you don´t find the right vacancy, please feel free to submit an open application CONTACT US Travel the world or spend time with your newborn familyTake some time off HR Automation leverages technology to streamline and optimize HR processes, reducing manual tasks and enhancing efficiency. By integrating HR software and AI-driven solutions, businesses can improve workforce management. 27 holidays annually Generous birth leave Buy additional 10 days off A competitive salary... - Published: 2025-01-31 - Modified: 2025-01-31 - URL: https://picpackaging.photonfirst.com/faq/ FAQWhat Makes Us Stand Out From the Rest How about something like "Empowering Your Workplace: Discover Our HR Management Journey"? CONTACT US 4. 5 Based on 5k Ready to help you Expert HR Management What is Human Resource Management (HRM)? It includes recruitment, training, employee relations, performance management, benefits administration, and compliance with labor laws. Why is HR important for my business? HR ensures that your business attracts and retains top talent, maintains compliance with labor laws, fosters a positive work culture, and improves overall employee productivity and engagement. How can HR help with employee retention? HR helps by creating competitive compensation packages, offering career growth opportunities, implementing recognition programs, and fostering an inclusive, engaging work environment. What is HR automation, and why is it important? HR automation uses technology to streamline HR tasks such as payroll, recruitment, and performance tracking. It improves efficiency, reduces errors, and allows HR teams to focus on strategic goals. What are the key HR compliance requirements? HR compliance includes adhering to labor laws, workplace safety regulations, anti-discrimination policies, fair compensation standards, and employee rights protections. How can HR support employee well-being? HR can implement wellness programs, offer flexible work arrangements, provide mental health support, and create a culture that prioritizes work-life balance. What’s the role of HR in performance management? HR sets performance goals, conducts evaluations, provides feedback, and implements development plans to enhance employee growth and company success. - Published: 2025-01-31 - Modified: 2025-01-31 - URL: https://picpackaging.photonfirst.com/team/ Co-OrdinatorAmelia Robinson Co-OrdinatorNatalie Wood Co-OrdinatorNico Robin Co-OrdinatorWilliam Young Co-OrdinatorDavid Miller Co-OrdinatorMonica Bellucci ## Posts