PIC Packaging for Mission-Critical Systems
Photonic Integrated Circuits are not just a promise, they are the next step in energy-efficient computing, sensing, quantum technologies, and ultra-fast data communication.
From the first prototype and the proof-of-concept to a qualified module that flies on satellites, functions in industrial harsh environments or survives in the rugged environments of defence equipment, we engineer dedicated packaging solutions.
We design, manufacture and assemble packages that keep working under random vibrations, temperature swings, mechanical stress and the shock of being lifted to space.
Harsh environments expose PIC packages to extreme thermal, mechanical, chemical, and radiation stresses that can degrade both structural integrity and optical performance. Compared with conventional electronics, PICs are especially sensitive because the packages themselves consist of multiple materials with different properties. Their functionality depends on maintaining precise optical alignment.Â
Successful deployment in aerospace and defence therefore requires robust package design, carefully selected materials, hermetic sealing, radiation tolerance, and qualification through established military and space reliability standards.Â
Why partner with PhotonFirst?
Facilities and Capabilities
Flexibility of Service
Personal Attention
Track Record
Ecosystem
High lights of use cases
