What we offer

From prototype to scaled deployment in aerospace, infrastructure, offshore and quantum systems – We build ruggedized packages for PICs serving the world’s most demanding environments and develop the systems required to operate them. Our products are engineered for deployment, not just for the lab. Qualified. Deployed. Proven.

Learn more about harsh environments

Harsh‑environment expertise

Over 2 decades of experience in packaging and deploying PICs in the harshest environments, such as defence and aerospace. All, while complying with MIL-STD and DO-standards.

State-of-the-art Facilities

Cleanroom manufacturing (ISO 14644-1 Class 8 environment with strict ESD controls) and proven performance in mission‑critical applications.

Pure Play Packaging Services

Supporting from the development of early prototypes all the way to validated series products and transferring the technology to our customers.

System integration & qualification

Deep domain knowledge of building and qualifying systems for harsh environments, including electronics, software, mechanical design and testing.

Our PIC packaging capabilities

PIC package design

Together with your team, our experts consider optical, electrical, mechanical, thermal and reliability aspects of your end application during the design of your PIC package.

PIC testing

We offer die-level testing of PIC and fibre arrays. Using Known Good Dies (KGD) and well tested parts, significantly increases the yield of your packaged PIC.

Die bonding

Our automated system places, glues or solders the components, with an accuracy ranging from ± 20 µm to ± 2 µm. This is followed by detailed inspection.

Wirebonding

We cover frequency ranges from DC up to 40 GHz by using manual and automated wirebonders. We offer ball and wedge bond using Au, Al, Cu, Pt and Ag wire with thicknesses ranging from 12.5 µm up to 75 µm.

Fibre alignment

Single fibre alignment is possible both using Active and Passive Alignment, achieving accuracies down to 100 nm. We offer SMF, PMF, lensed and UHNA fibres.

Fibre welding

This unique capability makes the package more robust and suitable for harsh environment, especially in aerospace and defence applications. Our Active Alignment fibre welding tool can achieve 100 nm accuracy.

Fibre array alignment

We offer Active Alignment of fibre arrays up to 140 channels. The fibres can be selected depending on your needs, including mixing of different types in a single array. We can work with edge or vertical coupling and can handle a large variety of MFD at the SSC.

System integration

We support your entire journey from bare PIC die all the way to a validated and qualified system, ready for your harsh environment applications.

Qualification and testing

Most harsh environment applications require MIL-STD and DO-160H compliant subsystems. We are well experienced with the iterative process of test, improvement and documentation that is required to achieve these qualifications.

Our PIC Packaging Portfolio

GP01/02/03

  • Designed for flexibility
  • Fast & affordable prototyping
  • 10GHz maximum frequency
    • Gold package

    GB01

  • High speed (4x RF)
  • Fast & affordable prototyping
  • 26GHz maximum frequency

    • SIP01

  • Opto-electric, multi-chip integration
  • Active-Passive integration + PCBa
  • Miniaturizing functional complexity

    • BP01

  • Butterfly package
  • Quick delivery, single die
  • DC up to 10 MHz
    • PIC Package - Harsh environment - 300x200

    XE01

  • Harsh environment
  • OEM-ready, system in a package
  • DC up to 10 GHz

    • CU01 ..x

  • Custom design, fit for high volume
  • OEM ready, mature product
  • Customisable for maximum frequency

    • Technical resources to get you started

    PIC Packaging - One Pager PrintA4
    download all PIC package specs here
    Design rules
    Download the pic packaging design rules
    PIC Package
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